WDS-520 Mobile Phone BGA Rework 

New Manual WDS-520 Mobile Phone BGA Rework Station

Total Power3500W
Upper Heating Power800W
Lower Heating PowerSecond zone: 1200W, Third zone: IR 2700W
Power SupplyAC 220V±10V, 50/60HZ
Locating ModeV-shape card slot, PCB holder can be adjustable byX and Y axes with universal jigs. Laser light to do fast centering and position
Temperature ControllingK-type thermocouple closed loop control, independent temperature control, precision up to ±3 degree
Overall Dimension395*450*590mm
PCB SizeMax 195*260mm,  Min 10*10mm
Thermocouple Ports1 unit

Main Features of WDS-520 bga rework station: 


1.Click RUN,solder and desolder the chips.cell phone motherboard repairing machine
2.Touch screen and PLC controlling to ensure it work stably and reliably.
3.Components mounting accuracy within 0.01mm , Repair success rate 99%.
4.Rework BGA, VGA, CCGA, QFN, CSP, LGA, SMD, etc.
5.Precise Temperature Control, accuracy within 2℃.
6.Three temperature zones to heat up independently.
7.Upper temperature zone can be moved freely, Second zone can be adjusted up and down. bga reballing machine 
8. Hot air nozzle can be rotated in 360 degree.
9.With CE certification, double over temperature protection function.

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WDS-520 Mobile Phone BGA Rework

  • Brands ُEGyCHip
  • Product Code: wds
  • Availability: 999
  • LE20,000

Tags: WDS-520 Mobile Phone BGA Rework