WDS-520 Mobile Phone BGA Rework
New Manual WDS-520 Mobile Phone BGA Rework Station
|Upper Heating Power||800W|
|Lower Heating Power||Second zone: 1200W, Third zone: IR 2700W|
|Power Supply||AC 220V±10V, 50/60HZ|
|Locating Mode||V-shape card slot, PCB holder can be adjustable byX and Y axes with universal jigs. Laser light to do fast centering and position|
|Temperature Controlling||K-type thermocouple closed loop control, independent temperature control, precision up to ±3 degree|
|PCB Size||Max 195*260mm, Min 10*10mm|
|Thermocouple Ports||1 unit|
Main Features of WDS-520 bga rework station:
1.Click RUN,solder and desolder the chips.cell phone motherboard repairing machine
2.Touch screen and PLC controlling to ensure it work stably and reliably.
3.Components mounting accuracy within 0.01mm , Repair success rate 99%.
4.Rework BGA, VGA, CCGA, QFN, CSP, LGA, SMD, etc.
5.Precise Temperature Control, accuracy within 2℃.
6.Three temperature zones to heat up independently.
7.Upper temperature zone can be moved freely, Second zone can be adjusted up and down. bga reballing machine
8. Hot air nozzle can be rotated in 360 degree.
9.With CE certification, double over temperature protection function.