WDS-620 IC Removal Tool BGA Chip Level Repair Machine For Mobile iPhone  Motherboard Repair

Independent 3 heating zones temperature control system:
1.The upper and lower hot air heating,which can heat up at the same time from the top of he component to the bottom of the PCB;bottom IR heating,temperature precision control within ±1℃.8 segment temperature control independently.

2.Hot air district heating for bga and PCB at the same time,and large area IR heater preheating up for the bottom of PCB to avoid completely PCB deformation during reworking,the upper or lower temperature zones could be used alone and combine freely the energy of up and lower heating element.

3.Adopted high precision K-type thermocouple close-loop control and PID parameter self-setting system;4 temperature curves can be displayed with instant curve analysis function and multi-group user data can be saved;temperature can be tested precisely through external measurement interface,curves can be analysed、set and correct on the touch screen at any time.

Precision optical alignment system:
4.Using HD and adjustable CCD color optical alignment system,beam split、amplification、lessening、fine adjustment and auto focus with the function that automatic color aberration resolution and brightness adjustment,adjustable image contrast;equipped with 15 ” high definition LCD monitor.

Multi-functional and humanized operation system:
1.Adopting the HD touch human-machine interface;upper heating head and mounting head designed 2 in 1;providing many kinds of titanium alloy bga tuyere can be rotated in 360 degree for easy installation and replacement.

2.X、Y and R angle adopted micrometer fine-tuning,accuracy locating,precision can reach ±0.01mm.

Superior safety protection function:
5.With the alarm function, after the bga welding the machine can alarm by itself.In the case of temperature abuse, the circuit can power off automatically with the double over-temperature protection.Temperature parameter having password protection to prevent any modification.

Higher automatic function:
6.Newest wds-620 is the updated system with 5 modes.It’s Remove,Mount,Weld,Manual and Semi-auto.The mode can be changed freely.It can be used under automatic,semi-auto & manual mode.

Power supply= AC 110V/220V±10% 50/60Hz
Total power= Max 5300W
Heater power= Upper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 2700W
Electrical material= Driving motor+PLC smart temp.controller+color touch screen
Temperature controlling= (high precision K-sensor)(Closed Loop),independent temp.controller,the precision can reach ±1℃
Locating way= V shape slot,PCB support jigs can adjust,laser light do fast centering and position
PCB size= Max 410*380mm Min 10*10 mm
Applicable chips= Max 80*80mm Min 1*1 mm
Overall dimension= L650×W630×H850mm
Temperature Interface= 1 pcs
Weight of machine= 60KG
Color= White&Blue

Watch the video to see how it works:

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WDS-620 IC Removal Tool BGA Chip Level Repair Machine For Mobile iPhone Motherboard Repair

  • Product Code: WDS-620
  • Availability: 1000
  • LE55,000

Tags: WDS-620 IC Removal Tool BGA Chip Level Repair Machine For Mobile iPhone Motherboard Repair, WDS-620