LV-07 BGA Rework station picture
二、LV-07 BGA Rework station introduction：
● Independent three-temperature zone temperature control system：
① Upper and lower temperature zone both are hot air heating, IR preheating zone for bright infrared heating,
the temperature is accurately controlled at ± 2 ℃, the upper and lower temperature zone can be heated from
the top of the components and the bottom of the PCB at the same time, meanwhile can be set up to 8

temperature control, so that the PCB board is heated uniformly, the bottom are the large IR preheating, so that
the entire PCB temperature, to prevent deformation, to ensure that the welding effect, the heating plate can be
independently controlled by the heating。
② BGA chips and PCB boards can be hot air local heating at the same time, supplemented by a large area of
infrared heaters on the bottom of the PCB board for preheating, can completely avoid the deformation of the
PCB board in the rework process; through the selection of the upper temperature zone can be used
individually or the lower temperature zone, and the free combination of upper and lower heaters Energy。
③ Select high-precision K-type thermocouple closed-loop control and PID parameter self-tuning system; can
simultaneously display four temperature curves and store multiple sets of user data, and has an instantaneous
curve analysis function; external temperature measurement interface to achieve precision detection of the
temperature, can be analyzed and calibrated at any time on the actual acquisition of the BGA temperature
curve. It can also analyze, set and correct the curve of temperature parameters on the touch screen at any
time.；
● Precise Optical Alignment System: Adopting high-definition adjustable CCD color optical vision alignment
system with beam splitting, zoom-in, zoom-out, and auto focus functions, and equipped with automatic
chromatic aberration resolution and brightness adjustment device, which can adjust the clarity of the image;
equipped with a 15” high-definition LCD monitor。
● Versatile and user-friendly operating system
① Adopting high-definition touch screen man-machine interface, upper heating device and mounting head
integrated design. Equipped with a variety of specifications of titanium alloy BGA nozzle, the nozzle can be
rotated 360 ° arbitrary, easy to install and replacement。
② The X and Y axes and the R angle are fine-tuned using micrometers for precise alignment and accuracy up
to±0.01mm。
● Superior Features：
①With 4 operating modes，Four modes: remove, weld, mounting, semi-auto。
.② Percentage air speed adjustment, fan speed and chip temperature profile saved at the same time。
③ Slide rails drive the upper heating head, more precision。
三、LV-07 technical parameters
Total power
44800W

Upper heating power
800W
Lower heating power
1200W
Lower heating power
2700W（1200W control）
Power supply
(Single Phase) AC 220V±10 50Hz
Positioning method
V-slot + universal fixture + laser positioning light for quick positioning
Temperature control
High-precision K-type thermocouple (Ksensor) closed loop control (Closed
Loop), the upper and lower independent temperature measurement (+2 degree);
Electrical Selection
Highly sensitive touch screen+micro controller＋stepper drive
Max PCB size
460×380mm
Min PCB size
10×10mm
Temperature sensor
1pcs
Chip magnification
1-200 times
PCB thickness
0.5-8mm
Applicable chips
0.8mm-6cm
Minimum chip pitch
0.15mm
Maximum load for
mounting
100G
Mounting accuracy
±0.01mm
Overall dimensions
L660×W640×H850mm
Machine weight
About 60kg