اليكم مجموعه فديوهات لطريقه الاستخدام
News Automatic BGA Rework Station infrared and hot air Mobile BGA Welding Machine with optical alignment for chips repair
Introduction
Our BGA Rework Station/ BGA reballing station are widely used to replace and repair the BGA chip in laptop, mobile phone, xbox360,ps3,etc.
The main user is repairing shops and factory to provide the after-sales service and rework.
How to separate BGA chip from motherboard
How to replace a new BGA chip
Repair steps
1) Separate the BGA chip from mother board -we called desoldering
2) Clean Pad
3) Reballing or replace a new BGA chip directly
4) Alignment/Positioning -Depend on experience ,silk frame ,optical camera
5) replace a new BGA chip – we called Soldering
| Total power | Max 2500W |
| Heater power | Upper temp.zone 1200W,Down temp.zone 1200W |
| Electrical material | Driving motor+ smart temp.controller+color touch screen |
| Temperature controlling | (high precision K-sensor)(Closed Loop),independent temp.controller,the precision can reach ±1 |
| Locating way | V shape slot,PCB support jigs can adjust |
| PCB size | Max 140×160mm Min 5×5 mm |
| Applicable chips | Max 80×80mm Min 1*1 mm |
| Overall dimension | L450*W470*H670mm |
| Temperature Interface | 1 pcs |
| Weight of machine | 40KG |
| Color | Blue+White Mini BGA rework station |
